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Jinghang Liu

Name:  Jinghang Liu

Position:  Doctoral (PhD) Research

Room No.:  220

Tel: +353 1 716 1768

Fax: + 353 1 283 0534


Qualifications: B.E., M.S.

Professional Affiliations: none


Short Biography:

Jinghang Liu graduated from the School of Mechatronics Engineering at Harbin Institute of Technology (HIT) in July 2005 with a BE degree. She then joined the "Nanopositioning and Micromanipulation Laboratory" in the Robotics Institute at HIT in pursuance of an MS degree which was awarded in July 2008. In June 2009, she joined the UCD AMS Research Centre to undertake doctoral research on sensor integration and adaptive control in Chemical Mechanical Planarisation (CMP), a process used extensively in the semiconductor industry.


Research Interests:

  • Sensors and sensor fusion
  • Adaptive control systems
  • Nanopositioning and micromanipulation systems

Research Project:

Sensor Integration and Adaptive Control of the Chemical Mechanical Planarisation (CMP) Process



Sensors, Adaptive Control, Intelligent Tooling, Chemical Mechanical Polishing



Chemical Mechanical Planarisation (CMP) is an enabling process technology in the semiconductor industry. It determines the planarity required of surfaces in photolithography where tolerances are of nanometer order over a typical die (chip) area. With each new generation of microprocessor or memory device, the planarity tolerances reduce so that CMP process capability must be continuously improved.

The current project involves the development of a novel system for control of the Von Mises stress distribution (the interfacial stress distribution) in CMP. The system addresses two fundamental principles in polishing using novel technologies with integrated sensors and adaptive control. The goal is to realise a paradigm improvement in process capability and provide solutions for larger diameter (450 mm and greater) substrates by more exacting control of interfacial pressures.


Academic Supervisor:

Prof. Dr.-Ing. Gerald Byrne

Dr Eamonn Ahearne



Research Images:

Westech 372 M CMP Tool

Force through Carrier Shaft