Analytical Service Techniques UK & Ireland

Principal Techniques

SEM: Scanning Electron Microscopy

FEI Quanta 3D FEG SEM

FEI Quanta 3D FEG SEM
Key Benefits
Most versatile Field Emission Scanning Electron Microscope (FE-SEM) available High Resolution images of surfaces Supports multiple analytical techniques (FIB, STEM, EDS, WDS, EBSD, CL) Environmental SEM capabilities
Capabilities
2 Scanning Electron Microscope in house 1.1 nm resolution FEG SEM Scanning TEM imaging [STEM] to a resolution of 0.7 nm. Large sample capability over 6cm in diameter Backscattered detector

TEM: Transmission Electron Microscopy

FEI Tecnai 300KV FEG

FEI Tecnai 300KV FEG
Key Benefits
Atomic resolution Transmission Electron Microscopy (TEM) Images on a nanometer scale Increased spatial resolution of EDX Crystallographic information Materials & biological samples.
Capabilities
Four TEM's in UCD 3D Tomography reconstructions Site specific TEM analysis for semiconductor failure / Product analysis Cryo TEM analysis & Plunge Freezing DualBeam FIB sample preparation capability, the ultimate failure analysis capability. Thickness measurements on nanometer thin films Crystallographic information

FIB: Focused Ion Beam

FEI Quanta 3D Dual Beam FIB

FEI Quanta 3D Dual Beam FIB
Key Benefits
High resolution Focused Ion Beam (FIB) cross sections Quick (S)TEM sample preparation Circuit edits for semiconductor applications Failure Analysis technique Milling and deposition of complex structures
Capabilities
DualBeam FIB - 5nm resolution Milling of cross sections up to 100 microns in depth Large samples accomadated

XPS: X-Ray Photoelectron Spectroscopy

Kratos Axis Ultra

Kratos Axis Ultra
Key Benefits
X-Ray Photoelectron Spectroscopy (XPS / ESCA) sensitivity at 0.1 At% Quantitative chemical information of the first 10nm atomic layers Oxidation state information of elements on the surface Multi sample capability Advanced failure analysis capability
Capabilities
Chemical information on the first 5-10nm

EDS / EDX: Energy Dispersive Spectroscopy

EDAX Trident

EDAX Trident
Key Benefits
Elemental composition of materials Element mapping capabilities of foreign materials Quick and economical Quantitative analysis achievable Excellent spatial resolution when combined with STEM
Capabilities
Identification of foreign material on a sub micron scale Complementary information to SEM, WDS, CL, EBSD Increased spatial resolution with STEM

Complimentary Techniques

SAXS: Small-angle X-ray scattering

Anton Parr SAXSess

Anton Parr SAXSess
Key Benefits
2nm-80nm particles Multiple samples types (powders, emulsions, liquids)
Capabilities
DNA, proteins, enzymes and viruses characterisation Size and size distribution of particles Molecular weight information Surface per volume Analysis of micro-emulsions

WDS: Wavelength Dispersive Spectroscopy

EDAX Trident LEXS

EDAX WDS
Key Benefits
Superior sensitivity than EDX Elemental analysis more accurate than EDX (less interference) 100nm to 1um thick films can be analysed
Capabilities
Determining thin film composition Measuring film uniformity across samples Both large and small areas can be measured accurately

EBSD: Electron Backscatter Diffraction

EDAX EBSD Hikari

EDAX EBSD Hikari
Key Benefits
Ability to analyse all crystal structures Access to all complementary techniques on the same system
Capabilities
Complete integration with other analytical techniques (CL, WDS and EDX) Point of interest or defined area of interest Significant number of mapping options

CL: Cathode-Luminescence

KE Centaurus

KE Centaurus
Key Benefits
Contrasting of different phases visualization of defects, Zoning and internal structures of solids Determination of the real structure Detection of trace elements, their valence and structural position
Capabilities
Identification of minerals, mineral distribution and quantification Typomorphic properties (CL colour, CL behaviour, spectral characteristics) Crystal chemistry (trace elements, internal structures, zoning) Reconstruction of geological processes Characterisation of technical products (also non-crystalline phases)

3D Optical Profilometry

Veeco

Veeco
Key Benefits
Non contact profilomety 2D and 3D capabilities Line scans
Capabilities
Surface roughness measurments Surface Topology

Metallurgy Analysis / Testing


Key Benefits
The metallurgy group is well equipped and staffed to evaluate materials ranging from cast iron to superalloys to composites. They have vast expereince in techniques of metallography, as well as the latest preparation methods.
Capabilities
Tensile strength Hardness Optical Emission Spectrometer Adhesion Flexural Strength Compressive Strength Modulus of Rupture

NIMAC, Scanning Transmission Electron Microscopy (STEM), Transmission Electron Microscopy (TEM), Focused Ion Beam (FIB), Scanning Electron Microscopy (SEM), Energy Dispersive Spectroscopy (EDS, EDX), Wavelength Dispersive Spectroscopy (WDS), Dual Beam FIB (DB-FIB), Electron Backscatter Diffraction (EBSD), Cathode-Luminescence (CL), Small-angle X-ray scattering (SAXS), TEM Service, SEM Service, EM service, Electron Microscopy service, FIB service, material analysis, surface analysis, analytical service company, Europe, america, Dublin